Soldering technology

In recent years, the assembly and soldering technologies of PCB components have evolved towards automation, going from traditional systems of manual assembly and soldering by hand or wave (Traditional Technology), to automatic assembly and soldering by reflow.
SAURO, in years of research, has developed products suitable for all reflow soldering processes belonging to the following technologies:

1. STH (SMD Through Hole), similar to PiP-Pin in Paste and THR-Through Hole Reflow Technology
2. SMT (Surface Mount Technology)

SAURO STH and SMD (Surface Mounting Device) products:
– a range in continuous expansion and identified with the letter H for STH product or D for SMD product in the fourth character of the product code;
– are made of insulating material classified MSL 1 (Moisture Sensitivity Level), according to the IPC / JEDEC J-STD-020E standard, and is therefore immune to the blistering effect caused by the absorption of moisture;
– are suitable to be automatically mounted on board using pick and place devices without use of pick up pad.

The technological evolution of SAURO which originated in the 1970’s with Traditional Technology, has evolved in the 1990’s to STH Lean Technology, and is now focused on STH Full Lean Technology, while looking to the future with the SMD Full Lean Technology.

The switch from Traditional Technology to STH Full Lean

Phases of the assembly process on PCB:

1) High precision positioning of SMD components through the use of pick and place robotic systems

2) Reflow soldering process

3) Manual positioning of the terminal blocks or male connectors in through holes

4) Manual or wave soldering of terminal blocks or male connectors.

This new technology has only two phases as it does not require manual assembly and wave or manual soldering.

Therefore, the steps of the PCB assembly process are:

1) High precision positioning of all SMD components and then, through the use of pick and place systems, all STH terminal blocks and male connectors

2) Passage of the board through the reflow soldering oven with all the components already positioned

In addition to these savings, the storage of material between soldering phases, required in traditional technologies, can also be eliminated, resulting in cost savings in terms of production time and space up to 70%.
SAURO, with its STH and SMD Technologies, drives customers to focus on the future and therefore push automation and this way, obtain savings in the assembly process that can make them more competitive and successful in the market.